SunnsTechnologies
We supply wire bonding, die pick-up and micro-assembly tools to semiconductor packaging, microwave hybrid circuit and microelectronic assembly lines.
- Year founded
- 2020
- Year founded
- Chhattisgarh, India · head office
- Bhilai
- Chhattisgarh, India · head office
- Partner factory
- China
- Partner factory
- Micro and shaped hole machining
- 0.01–0.4 mm
- Micro and shaped hole machining
01
Who we are
Sunns Technologies was founded in 2020 in Bhilai, Chhattisgarh, India. Our partner factory in China manufactures our wedge bonding tools, capillaries, pick-up nozzles and other micro-assembly tools.
Our range covers precision parts and tools in cemented carbide (tungsten carbide) and metallized ceramics, for semiconductor packaging, microelectronic assembly and microwave hybrid integrated circuits.
02
How we work
Each tool is designed with care and made through skilled process engineering at our partner factory. Its manufacturing and inspection equipment, together with a strict quality assurance system, keeps each tool true to its design and consistent between batches.
We tailor tools to your requirements and reply quickly with a practical proposal.
03
Capabilities
- Micro-hole machining
- Micro holes and shaped holes, 0.01 to 0.4 mm.
- Surface finishing
- Surface treatment and polishing to a precise finish.
- Ultra-hard materials
- Titanium carbide, tungsten carbide and other ultra-hard materials, machined to any shape.
05
Contact
- Head office
- Bhilai, Chhattisgarh, India
- Partner factory
- China
- Telegram
- @sunnstech