Bonding and assemblytools for chip packaging
We supply the tools behind wire bonding, die pick-up and micro-assembly.
We tailor tools to your requirements and reply quickly with a practical proposal.
Die attach tools
A pick-up nozzle is a precision consumable that picks up dies during chip packaging.
- 01Tungsten carbide, bakelite, rubber and ceramic
- 02Shank Ø3.175 mm or Ø1.585 mm
- 03For DATACON, PALOMAR, YAMAHA and other machines
- 04Custom nozzles made to your drawing
- Station
- 01 / 05
- Part
- SN-D-0001 · 3.0 × 0.2
Wedge bonding tools
A wedge bonding tool makes the wire connection between a chip and the circuit around it.
- 0114 series for manual and automatic bonders
- 02Fine wire, heavy wire and gold ribbon
- 03Feed angles from 30° to 60°
- 042–4 weeks for models in volume production
- Station
- 02 / 05
- Part
- SW-WFABSV-45O-1/16x1-CG2020-M-WX
Ceramic capillaries
Built for automatic bonders and high-volume production, ceramic capillaries are also easy to machine.
- 01ZTA or alumina (Al₂O₃)
- 02Body Ø1.585 mm, length 9.52 to 19.05 mm
- 03Standard, or with a bottleneck above the tip
- 0449 common models, or made to your drawing
- Station
- 03 / 05
- Part
- SC-BZ-H33-T100-CD46-15.88-20/11-OR13-90-M-BN10/250
Micro-assembly tools
Glue dipping heads are custom-made for fast, even dispensing.
- 01Glue dipping heads
- 02Tweezers
- 03Push blades, hook needles and cleaning needles
- 04Cutters, wire clamps and ejector pins
- Station
- 04 / 05
- Part
- SM-DH-0001
Made to your drawing
We tailor tools to your requirements and reply quickly with a practical proposal.
- 01Send your drawing or requirements
- 02Micro holes and shaped holes, 0.01 to 0.4 mm
- 03Carbide and other ultra-hard materials, precisely machined
- 042–4 weeks for models in volume production
- Station
- 05 / 05
- Part
- Four families
Send us your drawing
Send a drawing or describe what you need, and we will propose a tool to match.
Die attach tools, wedge bonding tools, ceramic capillaries and micro-assembly tools for semiconductor packaging and microelectronic assembly.